Are polymer solders the answer to lead-free assembly?

被引：0

作者：

机构：

[1] Gilleo, Ken

来源：

Gilleo, Ken | 1600年 / IHS Publ Group, Libertyville, IL, United States卷 / 09期

关键词：

Adhesives - Bond strength (materials) - Conductive plastics - Electric resistance - Electronic equipment manufacture - Fatigue of materials - Polymers;

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摘要：

Conductive adhesives offer a promising alternative to solder for electronic assembly. These materials are intrinsically clean and are considered the most environmentally acceptable joining materials for the process. Low temperature processing, fine-pitch capability, compatibility with almost any surface and wide processing attributes are the key properties of polymers. However, polymers are limited by their lower mechanical strength and the lack of a wave solder equivalent process.

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