Low-stress 3D packaging of a microsystem

被引：0
|
作者：
Morrissey, A. [1 ]
Kelly, G. [1 ]
Alderman, J. [1 ]
机构：
[1] Univ Coll, Cork, Ireland
来源：
Sensors and Actuators, A: Physical | 1998年 / 68卷 / 1 -3 pt 2期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Silicon sensors
引用
收藏
页码：404 / 409
相关论文
共 50 条
  • [21] Realtime 3D stress measurement in curing epoxy packaging
    Richter, J.
    Hyldgard, A.
    Birkelund, K.
    Hansen, O.
    Thomsen, E. V.
    TRANSDUCERS '07 & EUROSENSORS XXI, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 2007,
  • [22] Cu Pillar Low Temperature Bonding and Interconnection Technology of for 3D RF Microsystem
    Shi, G. X.
    Qian, K. Q.
    Huang, M.
    Yu, Y. W.
    Zhu, J.
    19TH ANNUAL CONFERENCE AND 8TH INTERNATIONAL CONFERENCE OF CHINESE SOCIETY OF MICRO/NANO TECHNOLOGY (CSMNT2017), 2018, 986
  • [23] Advanced Packaging of 3D Fan-out RF Microsystem for 5G IoT Communication
    Xia, Chenhui
    Wang, Hui
    Wang, Gang
    Ming, Xuefei
    2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2020,
  • [24] LOW-STRESS DILATION TEST
    HARDIN, BO
    JOURNAL OF GEOTECHNICAL ENGINEERING-ASCE, 1989, 115 (06): : 769 - 787
  • [25] Conformal coatings for 3D multichip microsystem encapsulation
    Janting, J
    Branebjerg, J
    Rombach, P
    SENSORS AND ACTUATORS A-PHYSICAL, 2001, 92 (1-3) : 229 - 234
  • [26] Integrated microsystem for 3D magnetic field measurements
    Malcovati, Piero
    Maloberti, Franco
    Conference Record - IEEE Instrumentation and Measurement Technology Conference, 1999, 1 : 71 - 74
  • [27] Integrated microsystem for 3D magnetic field measurements
    Malcovati, P
    Maloberti, F
    IEEE AEROSPACE AND ELECTRONIC SYSTEMS MAGAZINE, 1999, 14 (09) : 43 - 46
  • [28] The future of 3D packaging
    Val, CM
    2ND 1998 IEMT/IMC SYMPOSIUM, 1998, : 261 - 271
  • [29] Research of temporary bonding for 3D integrational Microsystem
    Shi, G. X.
    Wu, J.
    Qian, K. Q.
    Zhu, J.
    19TH ANNUAL CONFERENCE AND 8TH INTERNATIONAL CONFERENCE OF CHINESE SOCIETY OF MICRO/NANO TECHNOLOGY (CSMNT2017), 2018, 986
  • [30] 3D probe for dimensional metrology on microsystem components
    Kleine-Besten, T
    Loheide, S
    Brand, U
    Schlachetzki, A
    Bütefisch, S
    Büttgenbach, S
    TECHNISCHES MESSEN, 1999, 66 (12): : 490 - 495
12345