Low-stress 3D packaging of a microsystem

被引：0
|
作者：
Morrissey, A. [1 ]
Kelly, G. [1 ]
Alderman, J. [1 ]
机构：
[1] Univ Coll, Cork, Ireland
来源：
Sensors and Actuators, A: Physical | 1998年 / 68卷 / 1 -3 pt 2期
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D O I：
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学科分类号：
摘要：
Silicon sensors
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页码：404 / 409
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