The effect of current density and bath and annealing temperature on the hardness of nickel deposited from a nickel sulfamate-ethylene glycol-diethylene glycol mixed solvent solution is studied. It is shown that the hardness of nickel deposits decreases with increasing current density but show a declining trend with elevated annealing temperature. SEM micrographs show fine-grained deposits under optimum conditions, recrystallization of grains, and grain growth at high annealing temperatures. TEM studies indicate that the deposits are free from twinning and dislocations.