Power Supply Conductors for Fast Integrated Circuits and Multilayer Boards.

被引：0

作者：

Langer, Inge

机构：

来源：

Nachrichtentechnik Elektronik | 1976年 / 26卷 / 02期

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

INTEGRATED CIRCUIT MANUFACTURE

引用

页码：74 / 76

共 12 条

[1] Currentless Copper Plating of Multilayer Printed Circuit Boards.
Beier, Ernst
Elektronikpraxis, 1980, 15 (12): : 76 - 79
[2] FABRICATING POLYIMIDE-GLASS MULTILAYER PC BOARDS.
Schiavo, J.S.
DeForest, W.S.
Mearns, R.M.
Electronic Packaging and Production, 1978, 18 (03): : 69 - 72
[3] AUTOMATIC MASS SOLDERING OF WIRE WRAP TERMINAL/MULTILAYER BOARDS.
Faro, A.T.
Welding Journal (Miami, Fla), 1974, 53 (01):
[4] HIGH DENSITY INTERCONNECTION USING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARDS.
Kanamori, Takashi
Nihei, Kohji
Aida, Yoshimoto
Denshi Tokyo/Electron Tokyo, 1981, (20): : 123 - 126
[5] ADHESION-PROMOTING COPPER OXIDE FOR PLASTIC ON MULTILAYER CIRCUIT BOARDS.
Slominski, Leo J.
Landau, Adela
Plating and Surface Finishing, 1982, 69 (0n): : 96 - 99
[6] CURRENT LIMITER ADDED TO POWER SUPPLY PROTECTS SENSITIVE CIRCUITS.
Stitt, Mark
Electronic Design, 1975, 23 (03)
[7] STABILIZED POWER SUPPLY WITH INTEGRATED PULSE-DURATION MODULATION.
Gladyshev, S.P.
Chugaev, V.V.
Soviet electrical engineering, 1980, 51 (06): : 66 - 70
[8] Fast electromagnetics-based co-simulation of linear network and nonlinear circuits for the analysis of high-speed integrated circuits
School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907, United States
IEEE Trans. Microwave Theory Tech., 12 PART 1 (3677-3687):
[9] Investigation and Development of High Voltage Electric Power Line Protection Using Linear Integrated Circuits.
Alekseeva, O.N.
Ginovker, A.M.
Egovskii, A.A.
Khalikulov, I.B.
Trudy LPI, 1980, (369): : 44 - 47
[10] Navigation method utilizing floor-integrated inductive power supply modules for omnidirectional AGVs
Brenner, Carolin Carmen
Enssle, Alexander
Schulz, Robert
Parspour, Nejila
FORSCHUNG IM INGENIEURWESEN-ENGINEERING RESEARCH, 2023, 87 (02): : 617 - 626

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