REFLOW SOLDERING OF HYBRID CIRCUITS.

被引：0

作者：

Browne, Lawrence T.

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来源：

| 1600年 / 21期

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Compendex;

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摘要：

ELECTRONIC CIRCUITS

引用

共 50 条

[1] Repair Soldering of Printed Circuits.
Mueller, Helmut
Schweisstechnik (Berlin), 1979, 29 (04): : 153 - 155
[2] THIN FILM HYBRID CIRCUITS.
Travis, William
New Electronics, 1980, 13 (20):
[3] Thick-film Hybrid Circuits.
Winiger, Franz
1600, (51):
[4] New Mounting Technologies in the Manufacture of Hybrid Circuits.
Heymann, E.
Nachrichtentechnik, Elektronik, 1981, 31 (08): : 335 - 338
[5] Optimized Microthermostat Design for Hybrid Thin-Film Circuits.
Alekseev, V.P.
Vibe, P.F.
Izvestia vyssih ucebnyh zavedenij. Priborostroenie, 1980, 23 (03): : 91 - 95
[6] Constructional-Economic Characteristics of Large Hybrid Integrated Circuits.
Popov, V.P.
Ivantsov, V.P.
Chernov, I.V.
Izvestiya Vysshikh Uchebnykh Zavedenij. Radioelektronika, 1975, 18 (12): : 3 - 10
[7] SILICON INTEGRATED CIRCUITS.
Kahng, Dawon
Applied Solid State Science, 1981, (pt A):
[8] Design of Rectifier Circuits.
Fleischmann, Dieter
Nachrichten Elektronik, 1980, 34 (08): : 281 - 282
[9] MANUFACTURE OF MONOLITHIC CIRCUITS.
Jerndal, Ulf
Novak, Eva
Ericsson Review (English Edition), 1981, 58 (02): : 50 - 55
[10] MICROMANIPULATION OF SMALL CIRCUITS.
Smith, J.D.
Woore, J.
1976,