NEW LASER HERMETIC SEALING TECHNIQUE FOR ALUMINUM PACKAGE.

被引:0
|
作者
Sakai, Takeaki [1 ]
Okamoto, Shigeki [1 ]
Iikawa, Tsutomu [1 ]
Sato, Takehiko [1 ]
Henmi, Zenzo [1 ]
机构
[1] Fujitsu Ltd, Atsugi, Jpn, Fujitsu Ltd, Atsugi, Jpn
来源
IEEE transactions on components, hybrids, and manufacturing technology | 1986年 / CHMT-10卷 / 03期
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摘要
4
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页码:433 / 436
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