NEW LASER HERMETIC SEALING TECHNIQUE FOR ALUMINUM PACKAGE.

被引:0
|
作者
Sakai, Takeaki [1 ]
Okamoto, Shigeki [1 ]
Iikawa, Tsutomu [1 ]
Sato, Takehiko [1 ]
Henmi, Zenzo [1 ]
机构
[1] Fujitsu Ltd, Atsugi, Jpn, Fujitsu Ltd, Atsugi, Jpn
来源
IEEE transactions on components, hybrids, and manufacturing technology | 1986年 / CHMT-10卷 / 03期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
4
引用
收藏
页码:433 / 436
相关论文
共 50 条
  • [21] Miniaturized Samples for Bond Strength and Hermetic Sealing Evaluation for Transmission Laser Joints
    Newaz, Golam
    Sultana, Taslema
    Nusier, Saied
    Herfurth, Hans J.
    JOURNAL OF LASER MICRO NANOENGINEERING, 2008, 3 (03): : 186 - 195
  • [23] Face packing seals - new opportunities for pump rotor hermetic sealing
    Gaft, Y
    Zahorulko, A
    Martsynkovskyy, V
    Shevchenko, S
    16TH INTERNATIONAL CONFERENCE ON FLUID SEALING, 2000, (42): : 335 - 349
  • [24] Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device
    Cao, Yuhan
    Ning, Wenguo
    Luo, Le
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2009, 32 (03): : 125 - 132
  • [25] A Novel Hermetic Sealing Method for the Metal Package Based on Electric-Current-Assisted Sintering of Silver Paste
    Zhang, Yongfei
    Li, Xin
    Mei, Yunhui
    Lu, Guo-Quan
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (05): : 872 - 874
  • [26] Exploration of a new wafer-level hermetic sealing method by Cu/Sn isothermal solidification technique for MEMS/NEMS devices
    Du, MH
    Xu, W
    Luo, L
    Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II, 2005, 5650 : 332 - 336
  • [27] A Novel Technique for Determining the Location of a Hermetic Leak in a 'Metal Can' (TO-x) Package
    Nail, Carl
    ISTFA 2007, 2007, : 231 - 235
  • [28] Laser Sealing Technique for Fuel Cell Application
    Lin, Chih-Chia
    Wang, Wen-Lin
    Shie, Ho-yan
    POLYMER ELECTROLYTE FUEL CELLS 14, 2014, 64 (03): : 951 - 961
  • [29] A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding
    Cheng, YT
    Lin, LW
    Najafi, K
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2001, 10 (03) : 392 - 399
  • [30] A new sealing technology for ultra-thin glass to aluminum alloy by laser transmission welding method
    Zhang Min
    Chan Yufei
    Chen Changjun
    Qiu Zhaoling
    The International Journal of Advanced Manufacturing Technology, 2021, 115 : 2017 - 2035