Dry etch process in magnetic neutral loop discharge plasma

被引：0
|
作者：
ULVAC Japan Ltd, Kanagawa, Japan [1 ]
机构：
来源：
Jpn J Appl Phys Part 1 Regul Pap Short Note Rev Pap | / 1卷 / 332-336期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
13
引用
收藏
相关论文
共 50 条
  • [41] Optimizing the chromium dry etch process
    Ruhl, G.
    Dietrich, R.
    Ludwig, R.
    Falk, N.
    Morrison, T.
    Stoehr, B.
    Semiconductor International, 2001, 24 (08) : 239 - 240
  • [42] Very uniform and high aspect ratio anisotropy thru Si via etching process in magnetic neutral loop discharge plasma - art. no. 679812
    Morikawa, Yasuhiro
    Murayama, Takahide
    Suu, Koukou
    MICROELECTRONICS: DESIGN, TECHNOLOGY, AND PACKAGING III, 2008, 6798 : 79812 - 79812
  • [43] Etching characteristics of porous silica (k=1.9) in neutral loop discharge plasma
    Morikawa, Y
    Mizutani, N
    Ozawa, M
    Hayashi, T
    Chen, W
    Uchida, T
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2003, 21 (04): : 1344 - 1349
  • [44] Magnetic neutral loop discharge etching for 130 nm generation photomask fabrication
    Katsumata, M
    Kawahira, H
    PHOTOMASK AND NEXT-GENERATION LITHOGRAPHY MASK TECHNOLOGY VII, 2000, 4066 : 210 - 217
  • [45] A planar inductively coupled radio-frequency magnetic neutral loop discharge
    Gans, T.
    Crintea, D. L.
    O'Connell, D.
    Czarnetzki, U.
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2007, 40 (15) : 4508 - 4514
  • [46] Numerical study of capacitive coupled HBr/Cl2 plasma discharge for dry etch applications
    Gul, Banat
    Ahmad, Iftikhar
    Zia, Gulfam
    Aman-ur-Rehman
    PHYSICS OF PLASMAS, 2016, 23 (09)
  • [47] PLASMA ETCH PROCESS MODELING - APPLICATION TO AL ETCH PROCESS-DEVELOPMENT
    CHIU, KCR
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (03) : C85 - C85
  • [48] Two-dimensional modeling and optimization of a neutral loop discharge etcher in an argon plasma
    Okraku-Yirenkyi, Y
    Sung, YM
    Otsubo, M
    Honda, C
    Sakoda, T
    SURFACE & COATINGS TECHNOLOGY, 2002, 149 (2-3): : 185 - 191
  • [49] Effects of argon addition to a platinum dry etch process
    Milkove, K.R.
    Coffin, J.A.
    Dziobkowski, C.
    1998, AVS Science and Technology Society (16):
  • [50] Effect of chamber seasoning on the chrome dry etch process
    Clevenger, JO
    Buie, MJ
    Sandlin, N
    PHOTOMASK AND NEXT-GENERATION LITHOGRAPHY MASK TECHNOLOGY X, 2003, 5130 : 92 - 100
12345