APPARATUS FOR SEALING A SEMICONDUCTOR PACKAGE.

被引：0
|
作者：
Baker, M.R.
Noel, Y.J.
Shutts, L.
Thomson, W.G.
机构：
来源：
IBM Technical Disclosure Bulletin | 1976年 / 18卷 / 08期
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
SEMICONDUCTOR DEVICE MANUFACTURE
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页码：2596 / 2599
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