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- [22] Influence of flux selection and underfill selection on the reliability of flip-chips on FR-4 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 583 - 588
- [24] Experimental and numerical study of underfill encapsulation of flip-chips using conductive epoxy polymer bumps 47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 859 - 865
- [25] A comparative study on direct Cu–Cu bonding methodologies for copper pillar bumped flip-chips Journal of Materials Science: Materials in Electronics, 2018, 29 : 9347 - 9353
- [29] Novel Compact-Thermal-Model Approach to Estimate the Heat Spreading Effects of Flip-Chips on PCB regarding Laminar Flow Regimes 2019 25TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2019), 2019,
- [30] Reliability Study of Lead-Free Flip-Chips with Solder Bumps Down to 30 μm Diameter 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 583 - 589