WAFER FLATNESS TESTING.

被引:0
|
作者
Bettes, Ted C.
机构
关键词
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I
暂无
中图分类号
学科分类号
摘要
INTEGRATED CIRCUIT MANUFACTURE
引用
收藏
页码:77 / 92
相关论文
共 50 条
  • [1] ON-WAFER AND ON-MODULE CHIP TESTING.
    Tsui, F.
    IBM technical disclosure bulletin, 1984, 26 (08): : 4312 - 4323
  • [2] Laser Fizeau interferometer for silicon wafer site flatness testing
    Novak, E
    Olszak, A
    Stumpe, K
    Knowlden, B
    Malevanchik, L
    Angeli, G
    SURFACE CHARACTERIZATION FOR COMPUTER DISKS, WAFERS, AND FLAT PANEL DISPLAYS, 1999, 3619 : 101 - 109
  • [3] Approaching new metrics for wafer flatness: A investigation of the lithographic consequences of wafer on-flatness
    Valley, J
    Poduje, N
    Sinha, J
    Judell, N
    Wu, J
    Boonman, M
    Tempelaars, S
    van Dommelen, Y
    Kattouw, H
    Hauschild, J
    Grabbe, A
    Stanton, L
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XVIII, PTS 1 AND 2, 2004, 5375 : 1098 - 1108
  • [4] TESTING.
    Baker, Alan
    1600, (11):
  • [5] TESTING.
    Turner, Charles F.
    IEEE Potentials, 1986, 5 (01): : 25 - 28
  • [6] Wafer flatness modeling for scanning steppers
    Goodall, RK
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY X, 1996, 2725 : 76 - 84
  • [7] Language testing.
    Lys, F
    MODERN LANGUAGE JOURNAL, 2002, 86 (03): : 481 - 482
  • [8] THICKNESS TESTING.
    Sajdera, Norbert
    Metal Finishing, 1985, 83 (10) : 35 - 39
  • [9] Disinfectant testing.
    Drew, WN
    BRITISH MEDICAL JOURNAL, 1919, 1919 : 429 - 429
  • [10] AUTOMATED WAFER FLATNESS CHARACTERIZATION SYSTEM
    MORGAN, S
    SOBCZAK, Z
    LYNCH, G
    REID, L
    PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS, 1981, 275 : 92 - 99