Stress evolution during isochronal annealing of Ni/Si system

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Institute of Materials Engineering, National Chung-Hsing University, Taichung, Taiwan [1 ]
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Thin Solid Films | / 1卷 / 91-95期
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Number:; NSC86-2216-E-005-003; Acronym:; NSC; Sponsor: National Science Council;
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