OPTIMIZING THE IN-CIRCUIT TEST PROCESS.

被引：0
|
作者：
Curtis, Steve [1 ]
Douglas, Phil [1 ]
机构：
[1] Telex Corp, Raleigh, NC, USA, Telex Corp, Raleigh, NC, USA
来源：
Electron Manuf | 1988年 / 34卷 / 06期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
PRINTED CIRCUITS
引用
收藏
页码：11 / 13
相关论文
共 50 条
  • [41] In-circuit test of single-chip microcomputer-based circuit board
    Ding, Yijun
    Liu, Xin
    Gao, Ming
    1998, (19):
  • [42] REDUCING ERRORS IN AUTOMATED ANALOG IN-CIRCUIT TEST PROGRAM GENERATION
    MCDERMID, JE
    HEWLETT-PACKARD JOURNAL, 1984, 35 (10): : 31 - 36
  • [43] TEST FLIP-FLOPS GATES IN-CIRCUIT WITH THIS SIMPLE PROBE
    SPORRE, DL
    ELECTRONIC ENGINEER, 1969, 28 (01): : 96 - &
  • [44] In-circuit mixed-signal test without a bed of nails
    Parker, K
    IEEE DESIGN & TEST OF COMPUTERS, 1996, 13 (04): : 3 - 3
  • [45] CONTROL OF A SOFTWARE TEST PROCESS.
    Carey, Robert
    Bendick, Marc
    1600, IEEE, New York, NY
  • [46] Characterizing Mechanical Performance of Board Level Interconnects for In-Circuit Test
    Reinosa, Rosa
    Allen, Aileen
    Benedetto, Elizabeth
    Mcallister, Alan
    INTERNATIONAL TEST CONFERENCE 2010, 2010,
  • [47] Implementing bead probe technology for in-circuit test: A case study
    Farrell, Mike
    Leinbach, Glen
    2007 IEEE INTERNATIONAL TEST CONFERENCE, VOLS 1 AND 2, 2007, : 367 - +
  • [48] Thermodynamic Criterion for Optimizing a Contact Interaction Process.
    Filipchuk, A.I.
    Ryzhkin, A.A.
    Shchuchev, K.G.
    Klimov, M.M.
    Trenie i Iznos, 1982, 3 (01): : 147 - 153
  • [49] AN 8031 IN-CIRCUIT EMULATOR
    DINWIDDIE, G
    BYTE, 1986, 11 (07): : 181 - &
  • [50] Zhengda in-circuit tester
    Dianli Xitong Zidonghue, 4 (72):
12345