ELECTRON-BEAM APPARATUS FOR SOLDERING THE COMPONENTS OF SEMICONDUCTOR DEVICES.

被引：0

作者：

Komov, A.N. ^{[1
]}

Kolpakov, A.I. ^{[1
]}

Bondareva, N.I. ^{[1
]}

Zakharenko, V.V. ^{[1
]}

机构：

[1] Kuibyshev State Univ, Kuibyshev, USSR, Kuibyshev State Univ, Kuibyshev, USSR

来源：

Instruments and experimental techniques New York | 1984年 / 27卷 / 5 pt 2期

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摘要：

ELECTRON GUNS

引用

页码：1286 / 1288

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[1] AN ELECTRON-BEAM APPARATUS FOR SOLDERING THE COMPONENTS OF SEMICONDUCTOR-DEVICES
KOMOV, AN
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ZAKHARENKO, VV
INSTRUMENTS AND EXPERIMENTAL TECHNIQUES, 1984, 27 (05) : 1286 - 1288
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[3] BIBLIOGRAPHY ON ELECTRON BEAM INDUCED CURRENT ANALYSIS OF SEMICONDUCTOR DEVICES.
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Solid State Technology, 1977, 19 (02) : 45 - 48
[4] Development of electron-beam lithography for power semiconductor devices
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[5] PULSED ELECTRON-BEAM PROCESSING OF SEMICONDUCTOR-DEVICES
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[6] ELECTRON-BEAM TEST ON POWER SEMICONDUCTOR-DEVICES
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[7] USE OF AN ELECTRON-BEAM TO SEPARATE SEMICONDUCTOR-DEVICES WITH BEAM LEADS
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[8] Technology of Simultaneous Evaporation with Electron Beam Guns for Metallization of Semiconductor Devices.
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[9] BIBLIOGRAPHY ON ELECTRON-BEAM INDUCED CURRENT ANALYSIS OF SEMICONDUCTOR-DEVICES
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SOLID STATE TECHNOLOGY, 1977, 20 (02) : 45 - 48
[10] Development of electron-beam litography strategy for power integral semiconductor devices
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