The characteristics of all organic complementary circuits are discussed. The circuits were fabricated in an upside down geometry where the interconnections are defined first, followed by the gate metal and the gate insulator. The n-channel material F16CuPc is deposited at substrate temperature of 125 °C with a deposition rate of 1-5 angstroms/s under a vacuum pressure of 2×10-6 torr. The p-channel material is deposited with the substrate held at room temperature with a deposition rate of 1-5 angstroms/s under the same vacuum pressure. The SPICE simulation results for five stage ring oscillators are given.
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Pohang Univ Sci & Technol POSTECH, Dept Creat IT Engn, Pohang 790784, South KoreaPohang Univ Sci & Technol POSTECH, Dept Creat IT Engn, Pohang 790784, South Korea
Yoo, Hocheon
Ghittorelli, Matteo
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Univ Brescia, Dept Informat Engn, Via Branze 38, I-25123 Brescia, ItalyPohang Univ Sci & Technol POSTECH, Dept Creat IT Engn, Pohang 790784, South Korea
Ghittorelli, Matteo
Smits, Edsger C. P.
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TNO Dutch Org Appl Sci Res, Holst Ctr, High Tech Campus 31, NL-5656 AE Eindhoven, NetherlandsPohang Univ Sci & Technol POSTECH, Dept Creat IT Engn, Pohang 790784, South Korea
Smits, Edsger C. P.
Gelinck, Gerwin H.
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TNO Dutch Org Appl Sci Res, Holst Ctr, High Tech Campus 31, NL-5656 AE Eindhoven, NetherlandsPohang Univ Sci & Technol POSTECH, Dept Creat IT Engn, Pohang 790784, South Korea
Gelinck, Gerwin H.
Lee, Han-Koo
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Pohang Accelerator Lab, Pohang 790784, South KoreaPohang Univ Sci & Technol POSTECH, Dept Creat IT Engn, Pohang 790784, South Korea
Lee, Han-Koo
Torricelli, Fabrizio
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Univ Brescia, Dept Informat Engn, Via Branze 38, I-25123 Brescia, ItalyPohang Univ Sci & Technol POSTECH, Dept Creat IT Engn, Pohang 790784, South Korea
Torricelli, Fabrizio
Kim, Jae-Joon
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Pohang Univ Sci & Technol POSTECH, Dept Creat IT Engn, Pohang 790784, South KoreaPohang Univ Sci & Technol POSTECH, Dept Creat IT Engn, Pohang 790784, South Korea
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Northwestern Univ, Dept Chem, Evanston, IL 60208 USA
Northwestern Univ, Mat Res Ctr, Evanston, IL 60208 USA
Polyera Corp, Skokie, IL 60077 USANorthwestern Univ, Dept Chem, Evanston, IL 60208 USA
Usta, Hakan
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Facchetti, Antonio
Marks, Tobin J.
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Northwestern Univ, Dept Chem, Evanston, IL 60208 USA
Northwestern Univ, Mat Res Ctr, Evanston, IL 60208 USANorthwestern Univ, Dept Chem, Evanston, IL 60208 USA
机构:
Institute of Interdisciplinary Physical Sciences,School of Science,Nanjing University of Science and TechnologyInstitute of Interdisciplinary Physical Sciences,School of Science,Nanjing University of Science and Technology
Chen PAN
Jingwen SHI
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Institute of Brain-Inspired Intelligence,National Laboratory of Solid State Microstructures,School of Physics,Collaborative Innovation Center of Advanced Microstructures,Nanjing UniversityInstitute of Interdisciplinary Physical Sciences,School of Science,Nanjing University of Science and Technology
Jingwen SHI
Pengfei WANG
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Institute of Brain-Inspired Intelligence,National Laboratory of Solid State Microstructures,School of Physics,Collaborative Innovation Center of Advanced Microstructures,Nanjing UniversityInstitute of Interdisciplinary Physical Sciences,School of Science,Nanjing University of Science and Technology
Pengfei WANG
Shuang WANG
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Institute of Brain-Inspired Intelligence,National Laboratory of Solid State Microstructures,School of Physics,Collaborative Innovation Center of Advanced Microstructures,Nanjing UniversityInstitute of Interdisciplinary Physical Sciences,School of Science,Nanjing University of Science and Technology
Shuang WANG
Cong WANG
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Institute of Brain-Inspired Intelligence,National Laboratory of Solid State Microstructures,School of Physics,Collaborative Innovation Center of Advanced Microstructures,Nanjing UniversityInstitute of Interdisciplinary Physical Sciences,School of Science,Nanjing University of Science and Technology
Cong WANG
Bin CHENG
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Institute of Interdisciplinary Physical Sciences,School of Science,Nanjing University of Science and TechnologyInstitute of Interdisciplinary Physical Sciences,School of Science,Nanjing University of Science and Technology
Bin CHENG
Shi-Jun LIANG
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Institute of Brain-Inspired Intelligence,National Laboratory of Solid State Microstructures,School of Physics,Collaborative Innovation Center of Advanced Microstructures,Nanjing UniversityInstitute of Interdisciplinary Physical Sciences,School of Science,Nanjing University of Science and Technology
Shi-Jun LIANG
Feng MIAO
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Institute of Brain-Inspired Intelligence,National Laboratory of Solid State Microstructures,School of Physics,Collaborative Innovation Center of Advanced Microstructures,Nanjing UniversityInstitute of Interdisciplinary Physical Sciences,School of Science,Nanjing University of Science and Technology