Microstructure and properties of joint of H62 brass soldered using tin-lead solder

被引：0
|
作者：
Pan, Hui [1 ]
Sun, Ji-sheng [1 ]
Liu, Xiao-fang [1 ]
机构：
[1] Inst of Aeronautical Materials, Beijing, China
来源：
Hangkong Cailiao Xuebao/Journal of Aeronautical Materials | 2000年 / 20卷 / 04期
关键词：
Eutectics - Mechanical properties - Microstructure - Soldered joints - Soldering alloys - Solid solutions;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The microstructure of joint of H62 brass soldered using HLSn60PbSbA solder and the influences of soldering time on microstructure and properties are studied in this paper. It is observed that the joint consists of lead base solid solution, lead-tin base eutectic, copper base solid solution, cellular and block-shaped chemical compounds. Some plate-shaped chemical compounds occurred when soldering time is up to 120 s. And it is found that these plate-shaped chemical compounds can be considered to be the main reason for the decrement of mechanical properties, where the mechanical properties of the joint with the shortest holding time are the best.
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页码：26 / 29
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