Dispersibility of copper-plating sulfate electrolytes containing nitrate ions

被引：0
|
作者：
Braun, E.V. [1 ]
Savel'ev, M.I. [1 ]
Kruglikov, S.S. [1 ]
Yarlykov, M.M. [1 ]
Myagkova, S.I. [1 ]
机构：
[1] D.I. Mendeleev Inst of Chemical, Technology, Russia
来源：
Protection of Metals (English translation of Zaschita Metallov) | 1988年 / 24卷 / 02期
关键词：
Compact Copper Deposition - Copper Current Density - Copper Plating Sulfate Electrolytes - Electrolyte Dispersibility - Metal Dispersibility;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：238 / 240
相关论文
共 50 条
  • [21] LABORATORY PROCEDURE FOR COPPER-PLATING RUBBER BASE IMPRESSIONS
    CUMMINS, RL
    JOURNAL OF PROSTHETIC DENTISTRY, 1975, 33 (03): : 342 - 344
  • [22] Sedimentation of Ultradispersed Diamonds in the Citrate Copper-Plating Electrolyte
    Yaskelchik, V. V.
    Ananyev, M. V.
    Ostanina, T. N.
    Ostanin, N. I.
    Zharskiy, I. M.
    Chernik, A. A.
    RUSSIAN JOURNAL OF NON-FERROUS METALS, 2019, 60 (01) : 95 - 100
  • [23] MECHANISM OF CATHODIC PROCESS IN AMMONIACAL COPPER-PLATING ELECTROLYTE
    KUDRYAVTSEV, NT
    YARLYKOV, MM
    KADYRBEKOVA, AZ
    RUKINA, GI
    JOURNAL OF APPLIED CHEMISTRY OF THE USSR, 1977, 50 (08): : 1660 - 1663
  • [24] REMOVAL OF SUPERCONDUCTING SURFACE-SHEATH BY COPPER-PLATING
    MALSEED, CFS
    NETHERCO.RB
    RACHINGE.WA
    PHYSICS LETTERS, 1966, 22 (05): : 551 - &
  • [25] HIGHER GRADE MATERIALS THROUGH COPPER-PLATING OR ELECTROFORMING
    POTSCHKE, H
    METALL, 1971, 25 (06): : 659 - &
  • [26] SULFURIC-ACID ELECTROLYTE FOR BRIGHT COPPER-PLATING
    ANTROPOV, LI
    GORINA, DO
    LEDOVSKIKH, VM
    BABICH, AA
    PROTECTION OF METALS, 1978, 14 (03): : 293 - 294
  • [27] SULFATE ELECTROLYTES OF RHODIUM PLATING
    KRASIKOV, BS
    ASTAKHOVA, RK
    KOSENKO, MF
    JOURNAL OF APPLIED CHEMISTRY OF THE USSR, 1974, 47 (06): : 1313 - 1317
  • [28] DETERMINATION OF MAIN PARAMETERS FOR COPPER REGENERATION FROM WASTE SULFATE ELECTROLYTES OF COPPER PLATING
    DONCHENKO, MI
    SHUTKO, AP
    KOROTCHENKO, VS
    VOLOSHINA, VS
    UKRAINSKII KHIMICHESKII ZHURNAL, 1988, 54 (05): : 500 - 504
  • [29] Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
    Koga, Toshiaki
    Sakata, Yoshitaro
    Terasaki, Nao
    JOVE-JOURNAL OF VISUALIZED EXPERIMENTS, 2019, (145):
  • [30] STRUCTURES OF COPPER(II) COMPLEXES WHICH DEPOSIT COPPER IN CHEMICAL COPPER-PLATING BATH
    OHNO, S
    BULLETIN OF THE CHEMICAL SOCIETY OF JAPAN, 1978, 51 (10) : 3101 - 3102
12345