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Module level performance simulator for the figure of merit of electrical and optical interconnects
被引:0
作者
:
Guan, Lee
论文数:
0
引用数:
0
h-index:
0
机构:
Univ of Maryland, College Park, United States
Univ of Maryland, College Park, United States
Guan, Lee
[
1
]
Pusaria, Chandrasekhar
论文数:
0
引用数:
0
h-index:
0
机构:
Univ of Maryland, College Park, United States
Univ of Maryland, College Park, United States
Pusaria, Chandrasekhar
[
1
]
Halkias, George
论文数:
0
引用数:
0
h-index:
0
机构:
Univ of Maryland, College Park, United States
Univ of Maryland, College Park, United States
Halkias, George
[
1
]
Christou, Aris
论文数:
0
引用数:
0
h-index:
0
机构:
Univ of Maryland, College Park, United States
Univ of Maryland, College Park, United States
Christou, Aris
[
1
]
机构
:
[1]
Univ of Maryland, College Park, United States
来源
:
International Journal of Microcircuits and Electronic Packaging
|
1994年
/ 17卷
/ 01期
关键词
:
13;
D O I
:
暂无
中图分类号
:
学科分类号
:
摘要
:
引用
收藏
页码:50 / 61
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