INFLUENCE OF IMPURITY ANTIMONY AND BORON ON THE DUCTILITY GAP AND INTERGRANULAR FAILURE OF COPPER AT ELEVATED TEMPERATURES.

被引：0

作者：

Glikman, Ye.E.

Kotova, I.S.

Maslennikova, Ye.S.

Piguzov, Yu.V.

Rzhevskaya, I.Ya.

Rozenberg, V.M.

机构：

来源：

Physics of Metals and Metallography | 1974年 / 37卷 / 05期

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D O I：

暂无

中图分类号：

TG146.1+1 [铜]; TF811 [铜];

学科分类号：

摘要：

The influence of boron and antimony on the ductility gap of copper during high temperature deformation was investigated. The grain boundary adsorption of boron and antimony was studied by the methods of internal friction and luminescence analysis of the surface of intergranular fracture. The migration and boundary glide of grains in copper and a solid solution of copper with antimony and boron were studied metallographically. Antimony is found to aggravate and boron to reduce or completely eliminate, the ductility gap.

引用

页码：149 / 160

共 37 条

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