Liquid and solid bonding strength of Cu/Fe interface in copper clad steel

被引：0
|
作者：
Yu, J.M. [1 ]
Fang, X.Y. [1 ]
Xiao, Y.Z. [1 ]
机构：
[1] Northeastern Univ., Shenyang 110006, China
来源：
Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research | 2000年 / 14卷 / 06期
关键词：
Binders - Copper - Steel - Strength of materials - Surface treatment - Thermal effects - Two phase flow;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
This paper presents an investigation of copper clad steel wire produced by means of liquid and solid bonding method. The influences of process parameters, such as surface preparation method, preheating temperature, liquid copper temperature and bonding time, on bonding strength of Cu/Fe are systematically studied. The results show that the bonding strength in the interface hits the record of 95 MPa after the steel core is treated through preheating above the temperature of 400°C and applying surface welding supporting technology.
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页码：661 / 664
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