Versatile, low cost, multilayer ceramic board on metal core

被引：0

作者：

Kumar, Ananda H. ^{[1
]}

Prabhu, Ashok N. ^{[1
]}

Pendrick, Valerie A. ^{[1
]}

Thaler, Barry J. ^{[1
]}

机构：

[1] David Sarnoff Research Cent, Princeton, United States

来源：

International Journal of Microcircuits and Electronic Packaging | / 18卷 / 04期

关键词：

Ceramic materials - Cost effectiveness - Dielectric materials - Electronics packaging - Multichip modules - Multilayers - Printed circuit boards - Semiconducting glass - Substrates - Thick film devices;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

A low cost method for manufacturing multilayer ceramic boards on a metal core is described in this paper. The projected low cost is due to the ease of process control, high yields, and the choice of thick film silver conductors that enables fast firing in air ambient. The metal core completely suppresses the lateral shrinkage during sintering. It also enables the processing of large, thin substrates thereby increasing productivity. In use, the metal core can serve as a heat spreader, ground plane, and package reinforcement. Both single and double sided LTCC-M circuit boards have been fabricated on Cu-Mo-Cu metal cores. A glass-ceramic dielectric having low dielectric constant and low loss characteristics, thermal expansion coefficient matched to the metal core has been developed for this application. Additional thin film interconnects (MCM-C/D) structures can be formed on these substrates.

引用

页码：343 / 349