IMAGE PROCESSING BOOSTS THE POWER OF NON-DESTRUCTIVE TESTING.

被引:0
|
作者
Pound, Ronald [1 ]
机构
[1] Electronic Packaging &, Production, Des Plaines, IL, USA, Electronic Packaging & Production, Des Plaines, IL, USA
来源
Electronic Packaging and Production | 1985年 / 25卷 / 06期
关键词
IMAGE PROCESSING - INSPECTION - NONDESTRUCTIVE EXAMINATION - Imaging Techniques - ULTRASONIC APPLICATIONS - X-RAY ANALYSIS;
D O I
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中图分类号
学科分类号
摘要
The penetrating character of X-rays and ultrasonic signals suit them for the job of searching out hidden defects. X-ray transmission forms images of the interior of PC boards, solder joints, and components being inspected. Ultrasonic transmission is applied to inspection of hybrids, IC packages, and chip components. The paper reviews the inspection techniques for microelectronic equipment.
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页码:98 / 104
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