IMAGE PROCESSING BOOSTS THE POWER OF NON-DESTRUCTIVE TESTING.
被引:0
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作者:
Pound, Ronald
论文数: 0引用数: 0
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机构:
Electronic Packaging &, Production, Des Plaines, IL, USA, Electronic Packaging & Production, Des Plaines, IL, USAElectronic Packaging &, Production, Des Plaines, IL, USA, Electronic Packaging & Production, Des Plaines, IL, USA
Pound, Ronald
[1
]
机构:
[1] Electronic Packaging &, Production, Des Plaines, IL, USA, Electronic Packaging & Production, Des Plaines, IL, USA
来源:
Electronic Packaging and Production
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1985年
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25卷
/
06期
The penetrating character of X-rays and ultrasonic signals suit them for the job of searching out hidden defects. X-ray transmission forms images of the interior of PC boards, solder joints, and components being inspected. Ultrasonic transmission is applied to inspection of hybrids, IC packages, and chip components. The paper reviews the inspection techniques for microelectronic equipment.