ENHANCING THICK-FILM ADHESION ON ALUMINA CERAMIC.

被引：0

作者：

Bischoff, Bill ^{[1
]}

Petit, Ray ^{[1
]}

机构：

[1] Pulse Engineering Inc, San Diego,, CA, USA, Pulse Engineering Inc, San Diego, CA, USA

来源：

Electronic Packaging and Production | 1987年 / 27卷 / 03期

关键词：

D O I：

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中图分类号：

学科分类号：

摘要：

引用

页码：97 / 98

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