ENHANCING THICK-FILM ADHESION ON ALUMINA CERAMIC.

被引：0
作者：
Bischoff, Bill [1 ]
Petit, Ray [1 ]
机构：
[1] Pulse Engineering Inc, San Diego,, CA, USA, Pulse Engineering Inc, San Diego, CA, USA
来源：
Electronic Packaging and Production | 1987年 / 27卷 / 03期
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页码：97 / 98
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