HYBRID THICK - FILM CIRCUITS. THEIR DESIGN, APPLICATION AND MANUFACTURE.

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作者
Brooke, G.
Baldwin, W.E.B.
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Wireless World | 1973年 / 79卷 / 1449期
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摘要
The brief description of the hybrid thickfilm technology given in this article is intended to give encouragement and help to the equipment builders who have yet to adopt this form of component and circuit construction. The thick-film technique incurs very low tooling costs relative to monolithic circuits and hence even sample quantities are not expensive; in quantity the price per unit is even lower and will generally level off at about the 2000 mark.
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页码:121 / 125
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