Improved plating of PCB small holes using 'pulse plating' of acid copper

被引：0
|
作者：
机构：
来源：
Prod Finish (London) | / 5卷 / 3pp期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] PLATING OF COPPER INTO THROUGH-HOLES AND VIAS
    YUNG, EK
    ROMANKIW, LT
    ALKIRE, RC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1989, 136 (01) : 206 - 215
  • [22] ACID COPPER PLATING ON ALUMINUM
    ATKINSON, JTN
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1958, 105 (01) : 24 - 27
  • [23] Extension of copper plating to 0.13μm nodes by pulse-modulated plating
    Gandikota, S
    Duboust, A
    Neo, S
    Chen, LY
    Cheung, R
    Carl, D
    PROCEEDINGS OF THE IEEE 2000 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2000, : 239 - 241
  • [24] CYCLIC PULSE VOLTAMMETRIC STRIPPING ANALYSIS OF ACID COPPER PLATING BATHS
    TENCH, D
    WHITE, J
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (04) : 831 - 834
  • [25] SELECTIVE PULSE PLATING FROM AN ACID COPPER-SULFATE BATH
    VILAMBI, NRK
    CHIN, DT
    PLATING AND SURFACE FINISHING, 1988, 75 (01): : 67 - 73
  • [26] INNOVATVE ACID COPPER PROCESS FOR SIMULTANEOUSLY FILLING VIAS AND PLATING THROUGH HOLES
    Nikolova, Maria
    Rodriguez, Confesol
    Bowerman, William
    Watkowski, Jim
    Feng, Kesheng
    2017 12TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2017, : 107 - 110
  • [27] Copper-platinum deposition by pulse plating
    Mondal, K
    Lalvani, SB
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2006, 153 (06) : C393 - C399
  • [28] Pulse plating of cobalt–iron–copper alloys
    P.E. Bradley
    B. Janossy
    D. Landolt
    Journal of Applied Electrochemistry, 2001, 31 : 137 - 144
  • [29] PLATING OF COPPER IN TUBULAR HOLES WITH ROTATING SCREW ELECTRODES
    SCHWARTZ, M
    LI, W
    PHAN, NH
    NOBE, K
    PEARLSTEIN, AJ
    SURFACE & COATINGS TECHNOLOGY, 1992, 52 (03): : 269 - 274
  • [30] Electrodeposition of copper indium diselenide films using pulse plating technique
    Klochko, N. P.
    FUNCTIONAL MATERIALS, 2007, 14 (03): : 343 - 346
12345