Au wire bonding to Cu pad using Ti thin film

被引:0
|
作者
Ueno, Hiroshi [1 ]
机构
[1] Clarion Co, Ltd, Fukushima, Japan
来源
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 1992年 / 31卷 / 5 A期
关键词
539 Metals Corrosion and Protection; Metal Plating - 542 Beryllium; Lithium; Magnesium; Titanium and Other Light Metals and Alloys - 544 Copper and Alloys - 547 Minor; Precious and Rare Earth Metals and Alloys - 704 Electric Components and Equipment;
D O I
暂无
中图分类号
学科分类号
摘要
10
引用
收藏
页码:1547 / 1548
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