Electronic properties of liquid Ag-CuTe and Cu-AgTe systems

被引:0
|
作者
Uemura, O. [1 ]
机构
[1] Yamagata Univ, Japan
来源
关键词
Copper Silver Tellurium Alloys--Molten - Electric Conductivity - Magnetic Properties - Semiconducting Liquids--Electronic Properties - Silver Copper Tellurium Alloys--Molten;
D O I
暂无
中图分类号
学科分类号
摘要
Measurements of the electrical conductivity, magnetic susceptibility and thermoelectric power in liquid Ag-CuTe and Cu-AgTe systems have been made over a wide composition range. Both systems show a minimum in conductivity and a sharp maximum in diamagnetic susceptibility at the stoichiometric composition of AgCuTe, corresponding to the occurrence of electron localization. The nonmetallic nature of Ag-Te bonds with partial ionicity plays a preferential role in electron localization. On the other hand, the thermoelectric power in both systems gives a positive maximum near the composition of AgCuTe, which corresponds well to the anomalous composition dependence of the thermoelectric power found in the liquid Cu-Te system. This result suggests that the functional form of the electron density of states near the Fermi level is similar between liquid AgCuTe and liquid Cu2Te. These electronic properties are discussed in the light of the strong scattering regime for electrons employed in liquid semiconductors.
引用
收藏
页码:856 / 862
相关论文
共 50 条
  • [31] ELECTRONIC-PROPERTIES OF ALLOYS OF THE BINARY-SYSTEMS CU-TE, CU-SE, AND CU-S IN THE LIQUID-STATE
    KAZANDZHAN, BI
    MATVEEV, VM
    HIGH TEMPERATURE, 1980, 18 (01) : 61 - 67
  • [32] Calorimetric Study of the Formation of Liquid Ag–Cu–Sn Alloys. Enthalpy of Mixing for the Boundary Binary Cu–Ag, Cu–Sn, and Ag–Sn Systems at 1150°C
    K. I. Oleinik
    A. S. Bykov
    Russian Metallurgy (Metally), 2019, 2019 : 131 - 134
  • [33] Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging
    Zih-You Wu
    Tzu-Chia Wang
    Yu-Ching Wang
    Rui-Wen Song
    Su-Yueh Tsai
    Jenq-Gong Duh
    Journal of Materials Science: Materials in Electronics, 2022, 33 : 3016 - 3023
  • [34] Thermophysical Properties of Ag and Ag–Cu Liquid Alloys at 1098K to 1573K
    Przemysław Fima
    Natalia Sobczak
    International Journal of Thermophysics, 2010, 31 : 1165 - 1174
  • [35] Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging
    Wu, Zih-You
    Wang, Tzu-Chia
    Wang, Yu-Ching
    Song, Rui-Wen
    Tsai, Su-Yueh
    Duh, Jenq-Gong
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 33 (06) : 3016 - 3023
  • [36] Electronic structures and physical properties of FCC and metastable liquid Cu metals
    School of Materials Science and Engineering, Central South University, Changsha 410083, China
    Zhongnan Daxue Xuebao (Ziran Kexue Ban), 2007, 1 (1-8):
  • [37] Concentration dependence of thermodynamic, transport and surface properties in Ag–Cu liquid alloys
    I. S. Jha
    I. Koirala
    B. P. Singh
    D. Adhikari
    Applied Physics A, 2014, 116 : 1517 - 1523
  • [38] Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems
    Giuranno, Donatella
    Delsante, Simona
    Borzone, Gabriella
    Novakovic, Rada
    JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 689 : 918 - 930
  • [39] Structural, electronic and thermoelectric properties of SnTe with dilute co-doping of Ag and Cu
    Jamwal, Gaurav
    Kumar, Ankit
    Warish, Mohd.
    Chakravarty, Shruti
    Muthiah, Saravanan
    Kandasami, Asokan
    Niazi, Asad
    JOURNAL OF ALLOYS AND COMPOUNDS, 2023, 954
  • [40] Effect of impurities on the mechanical and electronic properties of Au, Ag, and Cu monatomic chain nanowires
    Cakir, D.
    Gulseren, O.
    PHYSICAL REVIEW B, 2011, 84 (08)