Slurry transport during chemical mechanical polishing

被引:0
|
作者
Fu, Ming-Nan [1 ]
Liao, Shan-Hui [1 ]
Li, Ching-Chung [2 ]
Chang, Pai-Yu [3 ]
机构
[1] Department of Industrial Engineering and Management, Chin Min Institute of Technology, 351 Taiwan, Taiwan
[2] Department of Computer Sciences, Chung Cheng Institute of Technology, National Defense University, 335 Taiwan, Taiwan
[3] Department of Product Design, Fortune Institute of Technology, 842 Taiwan, Taiwan
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:7843 / 7848
相关论文
共 50 条
  • [41] A novel slurry for chemical mechanical polishing of single crystal diamond
    Liao, Longxing
    Zhang, Zhenyu
    Meng, Fanning
    Liu, Dongdong
    Wu, Bin
    Li, Yubiao
    Xie, Wenxiang
    APPLIED SURFACE SCIENCE, 2021, 564
  • [42] Chemical mechanical polishing for sapphire wafers using a developed slurry
    Zhang, Zhenyu
    Liu, Jie
    Hu, Wei
    Zhang, Lezhen
    Xie, Wenxiang
    Liao, Longxing
    JOURNAL OF MANUFACTURING PROCESSES, 2021, 62 : 762 - 771
  • [43] Polishing performance and mechanism of a novel Fe-based slurry for chemical mechanical polishing
    Chen, Shidong
    Lei, Hong
    TRIBOLOGY INTERNATIONAL, 2024, 194
  • [44] Development of a novel chemical mechanical polishing slurry and its polishing mechanisms on a nickel alloy
    Zhang, Zhenyu
    Liao, Longxing
    Wang, Xinze
    Xie, Wenxiang
    Guo, Dongming
    APPLIED SURFACE SCIENCE, 2020, 506
  • [45] Development of a Copper Chemical Mechanical Polishing Slurry at Neutral pH Based on Ceria Slurry
    Kim, Yung Jun
    Kwon, Oh Joong
    Kang, Min Cheol
    Suh, Myung-Won
    Im, Young
    Kim, Jae Jeong
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 157 (10) : H952 - H958
  • [46] High Removal Rate Cobalt Slurry with Glutathione on Chemical Mechanical Polishing in Alkaline Slurry
    Xu, Aoxue
    Feng, Daohuan
    Wang, Weilei
    Liu, Weili
    Song, Zhitang
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2020, 9 (08)
  • [47] Tribocorrosion Study of Copper During Chemical Mechanical Polishing in Potassium Periodate-Based Slurry
    Cheng, Jie
    Wang, Tongqing
    Chai, Zhimin
    Lu, Xinchun
    TRIBOLOGY LETTERS, 2015, 58 (01) : 1 - 11
  • [48] Surface Interaction of Barrier Slurry Formulation Additives during Post Chemical Mechanical Polishing (CMP)
    Schlueter, J.
    Pearlstein, R. M.
    Shi, T.
    Henry, J.
    Haney, Robert J.
    CHEMICAL MECHANICAL POLISHING 11, 2010, 33 (10): : 137 - 144
  • [49] Tribocorrosion Study of Copper During Chemical Mechanical Polishing in Potassium Periodate-Based Slurry
    Jie Cheng
    Tongqing Wang
    Zhimin Chai
    Xinchun Lu
    Tribology Letters, 2015, 58
  • [50] Insight into Polishing Slurry and Material Removal Mechanism of Photoassisted Chemical Mechanical Polishing of YAG Crystals
    Zhang, Xiaoyu
    Guo, Xingchen
    Wang, Haoxiang
    Kang, Renke
    Gao, Shang
    LANGMUIR, 2023, 39 (38) : 13668 - 13677