ADVANCES IN THICK FILM CONDUCTORS FOR MICROWAVE INTEGRATED CIRCUITS.

被引：0

作者：

Johnson, R.Wayne

Rich, Phil W.

Rich, Debbie D.

Wilson, Larry K.

机构：

来源：

Electrocomponent Science and Technology | 1979年 / 6卷 / 3-4期

关键词：

D O I：

暂无

中图分类号：

TN7 [基本电子电路];

学科分类号：

080902 ;

摘要：

New conductor pastes have made possible great improvements in the loss characteristics of thick film microwave integrated circuits. This paper presents data on the microwave characteristics of transmission structures made from newly developed copper, silver and gold conductor pastes on alumina and garnet substrates. The resistivity and microstructure for each conductor material was examined for correlation with microwave properties. These data show that thick film circuits can give excellent performance through 18 GHz.

引用

页码：215 / 218

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