Lead-free solder to meet new safe drinking water regulations

被引：0
|
作者：
Bannos, T.S. [1 ]
机构：
[1] Engelhard Corp, United States
来源：
Welding Journal (Miami, Fla) | 1988年 / 67卷 / 10期
关键词：
Water Pipelines--Soldering;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Responding to the problem of developing a lead-free solder to meet new safe drinking water regulations, Engelhard Corp. developed Silvabrite 100, a lead-free solder that is acceptable under the new standards. This paper details its development.
引用
收藏
页码：23 / 26
相关论文
共 50 条
  • [1] LEAD-FREE SOLDER TO MEET NEW SAFE DRINKING-WATER REGULATIONS
    BANNOS, TS
    WELDING JOURNAL, 1988, 67 (10) : 23 - 26
  • [2] New lead-free solder alloy
    Kamal, M
    Meikhail, MS
    El-Bediwi, AB
    Gouda, ES
    RADIATION EFFECTS AND DEFECTS IN SOLIDS, 2005, 160 (07): : 301 - 312
  • [3] Lead-free solder
    Black, H
    CHEMISTRY & INDUSTRY, 2005, (21) : 22 - 23
  • [4] In pursuit of lead-free solder
    Birch, S
    AEROSPACE ENGINEERING, 2002, 22 (05) : 12 - 12
  • [5] The lead-free solder challenge
    Frear, Darrel
    Semicond Int, 11 (SP-20):
  • [6] The move to lead-free solder
    Woods, S
    CONNECTOR SPECIFIER, 2002, 18 (11) : 24 - 24
  • [7] PROGRESS IN THE DESIGN OF NEW LEAD-FREE SOLDER ALLOYS
    MCCORMACK, M
    JIN, SH
    JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1993, 45 (07): : 36 - 40
  • [8] Solder balling of lead-free solder pastes
    Minna Arra
    Dongkai Shangguan
    Erro Ristolainen
    Toivo Lepistö
    Journal of Electronic Materials, 2002, 31 : 1130 - 1138
  • [9] Analysis of new lead-free solder alloy microstructure
    Geng Zhiting
    Heqing
    Cheng Guohai
    Ma Jusheng
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 468 - 470
  • [10] Solder balling of lead-free solder pastes
    Arra, M
    Shangguan, D
    Ristolainen, E
    Lepistö, T
    JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (11) : 1130 - 1138
12345