Asymptotic expansions for the thermal stresses in bonded semi-infinite bimaterial strips

被引：0

作者：

Lee, Mikyoung ^{[1
]}

Jasiuk, I. ^{[1
]}

机构：

[1] Michigan State Univ, East Lansing, United States

来源：

Journal of Electronic Packaging, Transactions of the ASME | 1991年 / 113卷 / 02期

关键词：

Bonding;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：173 / 177

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