PACKAGING HIGH-VOLTAGE ELECTRONICS.

被引:0
|
作者
Harper, Charles A.
机构
来源
Electronic Packaging and Production | 1980年 / 20卷 / 08期
关键词
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:41 / 58
相关论文
共 50 条
  • [1] PACKAGING MILITARY ELECTRONICS.
    Markstein, Howard W.
    Electronic Packaging and Production, 1980, 20 (04): : 35 - 54
  • [2] VOLTAGE REGULATORS FOR ELECTRONICS.
    Harada, Koosuke
    1600, (10):
  • [3] High Performance Electronics.
    Pieper, Detlev
    Elektrizitatswirtschaft, 1986, 85 (15): : 547 - 550
  • [4] EXTENSION OF HIGH TEMPERATURE ELECTRONICS.
    Draper, Bruce L.
    Palmer, David W.
    Proceedings - Electronic Components and Technology Conference, 1979, : 40 - 46
  • [5] Piezoelectric Actuators With Integrated High-Voltage Power Electronics
    Yong, Yuen Kuan
    Fleming, Andrew J.
    IEEE-ASME TRANSACTIONS ON MECHATRONICS, 2015, 20 (02) : 611 - 617
  • [6] High-Voltage Phased Array Electronics for Ultrasound Neuromodulation
    Javid, Ardavan
    Biswas, Rudra
    Ilham, Sheikh Jawad
    Kiani, Mehdi
    2024 IEEE 67TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, MWSCAS 2024, 2024, : 543 - 546
  • [7] High-voltage DC transmission: A power electronics workhorse
    Hingorani, NG
    IEEE SPECTRUM, 1996, 33 (04) : 63 - 72
  • [8] Packaging Issues for High-Voltage Power Electronic Modules
    Ang, S. S.
    Evans, T.
    Zhou, J.
    Schirmer, K.
    Zhang, H.
    Rowden, B.
    Balda, J. C.
    Mantooth, H. A.
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011, 34 (01): : 893 - 898
  • [9] Dielectric Properties Characterization and Evaluation of Commercial Silicone Gels for High-Voltage High-Power Power Electronics Module Packaging
    Zhang, Boya
    Jiang, Xinyu
    Li, Kaixuan
    Yang, Ziyue
    Li, Xingwen
    Chang, Guiqin
    Ghassemi, Mona
    IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2023, 30 (01) : 210 - 219
  • [10] TELEVISION AND ELECTRONICS.
    Bouwer, P.F.
    Transactions of the South African Institute of Electrical Engineers, 1973, 64 (Part 6): : 111 - 125