Preparation of plasma chemical vapor deposition silicon nitride films from SiH2F2 and NH3 source gases

被引:0
|
作者
Watanabe, Nobuaki [1 ]
Yoshida, Mamoru [1 ]
Jiang, Yi-Chao [1 ]
Nomoto, Tutomu [1 ]
Abiko, Ichimatsu [1 ]
机构
[1] OKI Electric Industry Co., Ltd, Hachioji, Japan
来源
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 1991年 / 30卷 / 04期
关键词
Breakdown Strength - Fluorinated Silicon Nitride;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:619 / 621
相关论文
共 50 条
  • [1] PREPARATION OF PLASMA CHEMICAL VAPOR-DEPOSITION SILICON-NITRIDE FILMS FROM SIH2F2 AND NH3 SOURCE GASES
    WATANABE, N
    YOSHIDA, M
    JIANG, YC
    NOMOTO, T
    ABIKO, I
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1991, 30 (4A): : L619 - L621
  • [2] Investigation of precursors formed by mixing SiH2Cl2 with NH3 for chemical vapor deposition of silicon nitride films
    Kusakabe, Y
    Hanaoka, K
    Komori, H
    Ohnishi, H
    Yamanishi, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1997, 36 (1A): : 6 - 10
  • [3] Investigation of precursors formed by mixing SiH2Cl2 with NH3 for chemical vapor deposition of silicon nitride films
    Mitsubishi Electric Corp, Hyogo, Japan
    Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1997, 36 (1 A): : 6 - 10
  • [4] Silicon nitride films deposited by low pressure chemical vapor deposition from SiH4-NH3-N2 system
    Liu, XJ
    Huang, ZY
    Huang, LP
    EURO CERAMICS VIII, PTS 1-3, 2004, 264-268 : 643 - 646
  • [5] PLASMA DEPOSITION OF A-SI-H-F FILMS FROM SIH2F2 AND SIF4-SIH4
    NAKAYAMA, Y
    WAKIMURA, K
    TAKAHASHI, S
    KITA, H
    KAWAMURA, T
    JOURNAL OF NON-CRYSTALLINE SOLIDS, 1985, 77-8 : 797 - 800
  • [6] Remote plasma enhanced chemical vapor deposition of silicon nitride films in the system SiH4-N-2-NF3
    Aleksandrov, SE
    Khitchman, ML
    Grekov, FF
    Ivanov, VS
    RUSSIAN JOURNAL OF APPLIED CHEMISTRY, 1996, 69 (08) : 1118 - 1125
  • [7] Plasma assisted chemical vapor deposition silicon oxynitride films grown from SiH4+NH3+O2 gas mixtures
    Olivares-Roza, J
    Sanchez, O
    Albella, JM
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1998, 16 (05): : 2757 - 2761
  • [8] OXIDATION-KINETICS OF PLASMA-ENHANCED CHEMICAL VAPOR-DEPOSITION SILICON-NITRIDE FILMS DEPOSITED FROM SIH4/NH3/NF3/N2 MIXTURES
    GOMEZALEIXANDRE, C
    GARRIDO, OS
    ALBELLA, JM
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1990, 8 (03): : 540 - 543
  • [9] SYNCHROTRON RADIATION-EXCITED CHEMICAL VAPOR-DEPOSITION OF SILICON-NITRIDE FILMS FROM A SIH4 + NH3 GAS-MIXTURE
    KYURAGI, H
    URISU, T
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1991, 138 (11) : 3412 - 3416
  • [10] CHEMICAL VAPOR-DEPOSITION OF A SILICON-NITRIDE LAYER WITH AN EXCELLENT INTERFACE BY NH3 PLASMA TREATMENT
    SHIMODA, S
    SHIMIZU, I
    MIGITAKA, M
    APPLIED PHYSICS LETTERS, 1988, 52 (13) : 1068 - 1070