Locating defects in face-down chips

被引：0
|
作者：
Hurley, Daniel T. [1 ]
机构：
[1] Hypervision Inc & Tom Adams
来源：
Electronic Engineering (London) | 2000年 / 72卷 / 876期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Integrated circuit testing
引用
收藏
页码：11 / 12
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