Locating defects in face-down chips

被引：0

作者：

Hurley, Daniel T. ^{[1
]}

机构：

[1] Hypervision Inc & Tom Adams

来源：

Electronic Engineering (London) | 2000年 / 72卷 / 876期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Integrated circuit testing

引用

页码：11 / 12

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