ADHESIVE GLUE FOR SURFACE-MOUNT DEVICES.

被引：0

作者：

Iwasa, Yamahiro ^{[1
]}

Sato, Yoneji ^{[1
]}

机构：

[1] Asahi Chemical Research Lab, Jpn, Asahi Chemical Research Lab, Jpn

来源：

JEE. Journal of electronic engineering | 1987年 / 24卷 / 242期

关键词：

ADHESIVES; -; Bonding;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Methods available for placing chip components are the temporary adhesive pre-soldering and cream soldering methods. Selection, features, processings and future problems relative to the adhesive glue used for securing the chip components are explained in this article.

引用

页码：65 / 68

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