ADHESIVE GLUE FOR SURFACE-MOUNT DEVICES.

被引：0
|
作者：
Iwasa, Yamahiro [1 ]
Sato, Yoneji [1 ]
机构：
[1] Asahi Chemical Research Lab, Jpn, Asahi Chemical Research Lab, Jpn
来源：
JEE. Journal of electronic engineering | 1987年 / 24卷 / 242期
关键词：
ADHESIVES; -; Bonding;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Methods available for placing chip components are the temporary adhesive pre-soldering and cream soldering methods. Selection, features, processings and future problems relative to the adhesive glue used for securing the chip components are explained in this article.
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页码：65 / 68
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