RECENT ADVANCES IN SUBSTRATE SAWING TECHNOLOGY.

被引：0

作者：

Dyer, Lawrence D.

机构：

来源：

Industrial Diamond Review | 1984年 / 44卷 / 501期

关键词：

SAWS; -; Diamond;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Substrate sawing for the semiconductor industry using diamond blades consumes an estimated 2 million carats per year of industrial diamonds. Recent advances in substrate sawing technology are reviewed, namely large capacity saws, slice retrieval, fault systems, and productivity-increasers. Also, some new features called for by users are outlined: in-situ blade tension and drag measurements among others.

引用

页码：74 / 76