Plasma polymerization coating of silica fillers for epoxy molding compounds (EMCs)

被引:0
|
作者
机构
[1] Lee, J.H.
[2] Roh, J.H.
[3] Yoon, T.H.
来源
Yoon, T.H. (thyoon@kjist.ac.kr) | 1600年 / VSP BV卷 / 17期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold
    Chiu, S. M.
    Hwang, S. J.
    Chu, C. W.
    Gan, Dershin
    THIN SOLID FILMS, 2006, 515 (01) : 285 - 292
  • [42] Silica nanoparticles as surfactants and fillers for latexes made by miniemulsion polymerization
    Tiarks, F
    Landfester, K
    Antonietti, M
    LANGMUIR, 2001, 17 (19) : 5775 - 5780
  • [43] EXPANDING ROLE FOR EPOXY-RESIN MOLDING COMPOUNDS
    MARTIN, DJ
    PLASTICS & RUBBER INTERNATIONAL, 1979, 4 (06): : 265 - 268
  • [44] Improving Moldability by Regulating Thixotropy of Epoxy Molding Compounds
    Liu, Xiang
    Lu, Roger
    Xie, Guangchao
    Gu, Haiyong
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [45] NEW SILICONE-EPOXY ELECTRONIC MOLDING COMPOUNDS
    ANTONEN, RC
    MICHAEL, KW
    JOURNAL OF ELECTRONIC MATERIALS, 1976, 5 (04) : 447 - 447
  • [46] FLOW-CURE BEHAVIOR OF EPOXY MOLDING COMPOUNDS
    SCHREIBER, B
    ARNOLD, L
    KUNSTSTOFFE-GERMAN PLASTICS, 1979, 69 (03): : 163 - 167
  • [47] MOISTURE SORPTION IN EPOXY MOLDING COMPOUNDS FOR MICROELECTRONIC PACKAGING
    BELTON, DJ
    MOLTER, MJ
    SULLIVAN, EA
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1988, 196 : 132 - PMSE
  • [48] EPOXY MOLDING COMPOUNDS AS ENCAPSULATION MATERIALS FOR MICROELECTRONIC DEVICES
    KINJO, N
    OGATA, M
    NISHI, K
    KANEDA, A
    ADVANCES IN POLYMER SCIENCE, 1989, 88 : 1 - 48
  • [49] Mechanically relevant chemical shrinkage of epoxy molding compounds
    Sousa, M. F.
    Hoelck, O.
    Braun, T.
    Bauer, J.
    Walter, H.
    Wittler, O.
    Lang, K. D.
    2013 14TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2013,
  • [50] Moisture diffusion in epoxy molding compounds filled with particles
    Uschitsky, M
    Suhir, E
    JOURNAL OF ELECTRONIC PACKAGING, 2001, 123 (01) : 47 - 51