Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements

被引:0
作者
Gan, Dongwen [1 ]
Ho, Paul S. [1 ]
Huang, Rui [2 ]
Leu, Jihperng [3 ]
Maiz, Jose [3 ]
Scherban, Tracey [3 ]
机构
[1] Laboratory for Interconnect and Packaging, University of Texas, Austin, TX 78712, United States
[2] Department of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, TX 78712, United States
[3] Intel Corporation, Hillsboro, OR 97214, United States
来源
Journal of Applied Physics | 2005年 / 97卷 / 10期
关键词
This work was supported in part by the Advanced Technology Program of Texas Higher Education Coordinating Board and Intel Corporation. The authors would like to thank Jun He of Intel for helpful discussions;
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