HIGH PERFORMANCE COPPER ROD BREAKDOWN MACHINERY AND NONFERROUS SPOOLLESS CORES HANDLING EQUIPMENT.

被引:0
|
作者
Peene, Guido J.
Kemel, Noel E.
机构
来源
Wire journal | 1980年 / 13卷 / 01期
关键词
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I
暂无
中图分类号
学科分类号
摘要
WIRE DRAWING MACHINES
引用
收藏
页码:56 / 60
相关论文
共 5 条
  • [1] HIGH PERFORMANCE LLDPE BLOWN FILM EQUIPMENT.
    Veazey, Earl W.
    Journal of Plastic Film and Sheeting, 1985, 1 (01): : 60 - 67
  • [2] RFIC chipset for high performance, cellular radio test equipment.
    Caliumi, A
    Masini, L
    Christensen, SB
    Aglietti, M
    27TH EUROPEAN MICROWAVE 97, CONFERENCE + EXHIBITION - BRIDGING THE GAP BETWEEN INDUSTRY AND ACADEMIA, VOLS I AND II, 1997, : 1175 - 1180
  • [3] FREQUENCY-CONTROLLED ELECTRIC DRIVE OF HIGH-PERFORMANCE HOISTING EQUIPMENT.
    Gusyatskii, Yu.M.
    Dmitriev, V.I.
    Pevzner, E.M.
    Yaure, A.G.
    Soviet electrical engineering, 1982, 53 (01): : 82 - 86
  • [4] High-performance insulating materials with high breakdown strength and low permittivity for eco-friendly electrical equipment
    Sima, Wenxia
    Chen, Xiaoxiao
    Sun, Potao
    Yuan, Tao
    Yang, Ming
    Pang, Wenlong
    Li, Zhaoping
    Fu, Ninglong
    Tang, Xinyu
    JOURNAL OF COLLOID AND INTERFACE SCIENCE, 2025, 680 : 2 - 8
  • [5] A 0.11 μm CMOS technology with copper and very-low-k interconnects for high-performance system-on-a chip cores
    Takao, Y
    Kudo, H
    Mitani, J
    Kotani, Y
    Yamaguchi, S
    Yoshie, K
    Kawano, M
    Nagano, T
    Yamamura, I
    Uematsu, M
    Nagashima, N
    Kadomura, S
    INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, : 559 - 562