Theory and Application of the Semi-additive Technology - 1. Basic Materials and Chemical Processes.

Materials like FR2, FR3, G10, and FR4 are used as the basis of conductor plates. For adhesive coating of such plates before metallizing, two groups are distinguished, i. e. , core catalyzed and fully catalyzed materials. The mechanical and chemical steps of their manufacture into copper plated conductor plates are reviewed. This covers coating with the adhesion-causing agent, punching, and drilling, and etching and activating respectively. The theory and automated control of chemical copper plating and the physical properties of the product are described in detail.