Theory and Application of the Semi-additive Technology - 1. Basic Materials and Chemical Processes.

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作者：

Ruff, C.W.

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来源：

| 1600年 / 29期

关键词：

ELECTROLESS PLATING - Copper;

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摘要：

Materials like FR2, FR3, G10, and FR4 are used as the basis of conductor plates. For adhesive coating of such plates before metallizing, two groups are distinguished, i. e. , core catalyzed and fully catalyzed materials. The mechanical and chemical steps of their manufacture into copper plated conductor plates are reviewed. This covers coating with the adhesion-causing agent, punching, and drilling, and etching and activating respectively. The theory and automated control of chemical copper plating and the physical properties of the product are described in detail.

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