Hydrolysis and Buffering in Nickel Plating Solutions.

Boric acid is used in nickel electrodeposition as a buffer to suppress the formation of nickel hydroxide as well as to reduce the increase in the pH of the cathodic diffusion layer. Other buffering substances, such as citric, acetic, and glyceroboric acid, are also discussed. To obtain stress-free and ductile deposits, effective buffering of nickel plating solutions is of great importance. The effects and relationships are described.