Beyond the 1 GHz barrier with thick-film ceramic

被引：0
作者：
DuPont Electronic Materials, Research Triangle Park, United States [1 ]
机构：
来源：
Microwave J | / 11卷 / 6pp期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Dielectric-Barrier Microdischarge Structure for Efficient Positive-Column Plasma Using a Thick-Film Ceramic Sheet
    Cho, Tae-Seung
    Shin, Hyea-Weon
    Jung, Jin-Woo
    IEEE TRANSACTIONS ON PLASMA SCIENCE, 2009, 37 (08) : 1607 - 1610
  • [42] AN MDS DOWN CONVERTER OF THICK-FILM MIC FOR 2 GHZ PAY TV
    UWAMO, T
    KITAMURA, H
    HASHIMA, A
    IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, 1981, 27 (03) : 410 - 416
  • [43] A successful thick-film implementation of a 10 GHz phase locked oscillator module
    Delzer, SJ
    Roland, L
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 34 - 39
  • [44] Multilayer Thick-Film Photoimageable Technology for 60 GHz System-in-Package
    Robertson, I. D.
    Samanta, K. K.
    APMC: 2008 ASIA PACIFIC MICROWAVE CONFERENCE (APMC 2008), VOLS 1-5, 2008, : 1639 - 1642
  • [45] 77GHz MMIC transceiver modules with thick-film multi-layer ceramic substrate for automotive radar applications
    Nagaishi, H
    Shinoda, H
    Kondoh, H
    Takano, K
    2003 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2003, : 1949 - 1952
  • [46] THICK-FILM MATERIALS FOR HYBRIDS
    COLEMAN, M
    RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
  • [47] COMPUTERIZED THICK-FILM PRINTER
    KOLC, RF
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (03): : 327 - 330
  • [48] THICK-FILM BIOSENSORS FOR UREA
    BILITEWSKI, U
    DREWES, W
    SCHMID, RD
    SENSORS AND ACTUATORS B-CHEMICAL, 1992, 7 (1-3) : 321 - 326
  • [49] THICK-FILM PRESSURE SENSORS
    HARSANYI, G
    HAHN, E
    MECHATRONICS, 1993, 3 (02) : 167 - 171
  • [50] LTCC and thick-film microresistors
    Dziedzic, A
    Mis, E
    Rebenklau, L
    Wolter, KJ
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1885 - 1890
12345