Modification of the Preston equation for the chemical-mechanical polishing of copper

被引：0
|
作者：
Clarkson Univ, Potsdam, United States [1 ]
机构：
来源：
Thin Solid Films | / 1-2卷 / 160-167期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics
    Gutmann, RJ
    Steigerwald, JM
    You, L
    Price, DT
    Neirynck, J
    Duquette, DJ
    Murarka, SP
    THIN SOLID FILMS, 1995, 270 (1-2) : 596 - 600
  • [22] Chemical-mechanical Polishing of Copper Using Molybdenum Dioxide Slurry
    Sharath Hegde
    Udaya B. Patri
    S. V. Babu
    Journal of Materials Research, 2005, 20 (9) : 2553 - 2561
  • [23] Interfacial transfer between copper and polyurethane in chemical-mechanical polishing
    Hong Liang
    Thierry Le Mogne
    Jean-Michel Martin
    Journal of Electronic Materials, 2002, 31 : 872 - 878
  • [24] Stabilization of gamma alumina slurry for chemical-mechanical polishing of copper
    Song, Myung-Geun
    Lee, Jin-ho
    Lee, Yoon-Gyu
    Koo, Ja-ho
    JOURNAL OF COLLOID AND INTERFACE SCIENCE, 2006, 300 (02) : 603 - 611
  • [25] Interfacial transfer between copper and polyurethane in chemical-mechanical polishing
    Liang, H
    Le Mogne, T
    Martin, JM
    JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (08) : 872 - 878
  • [26] Electrochemical effects in the chemical-mechanical polishing of copper for integrated circuits
    Sainio, CA
    Duquette, DJ
    Steigerwald, J
    Murarka, SP
    JOURNAL OF ELECTRONIC MATERIALS, 1996, 25 (10) : 1593 - 1598
  • [27] Chemical-mechanical polishing of copper using molybdenum dioxide slurry
    Hegde, S
    Patri, UB
    Babu, SV
    JOURNAL OF MATERIALS RESEARCH, 2005, 20 (09) : 2553 - 2561
  • [28] Polishing mechanism of mechano-chemical and chemical-mechanical polishing
    Watanabe, J
    JOURNAL OF JAPANESE SOCIETY OF TRIBOLOGISTS, 1997, 42 (10) : 749 - 754
  • [29] Boron-Based Nanoparticles for Chemical-Mechanical Polishing of Copper Films
    He, Xingliang
    Joo, Sukbae
    Xiao, Huaping
    Liang, Hong
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2013, 2 (01) : P20 - P25
  • [30] Electrochemical characteristic of chemical-mechanical polishing of copper with oxide passive film
    He, HW
    Hu, YH
    Zhou, KC
    Xiong, X
    Huang, BY
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2003, 13 (04) : 977 - 981
12345