共 50 条
- [23] Three-dimensional monolithic microwave integrated circuit technology for fully computer-aided design-compatible monolithic microwave integrated circuit development Int J RF Microwave Comput Aided Eng, 6 (498-506):
- [24] Efficient full-wave analysis of packaging interconnects with bends using the Method of Moments ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2003, : 363 - 366
- [25] An efficient solver for the three-dimensional capacitance of the interconnects in high speed digital circuit by the multiresolution method of moments IEEE TRANSACTIONS ON ADVANCED PACKAGING, 1999, 22 (01): : 9 - 15
- [26] Millimeter-wave monolithic integrated circuit interconnects using electromagnetic field coupling IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (02): : 278 - 282
- [28] Development of three-dimensional monolithic microwave integrated circuit components TERAHERTZ AND GIGAHERTZ ELECTRONICS AND PHOTONICS II, 2000, 4111 : 192 - 200
- [29] Thermal Analysis and Verification of a Mounted Monolithic Integrated Circuit IEEE SOUTHEASTCON 2010: ENERGIZING OUR FUTURE, 2010, : 37 - 40