LASER SCRIBING AND DRILLING OF CERAMIC SUBSTRATES.

被引：0
|
作者：
Belland, Robert
机构：
来源：
Electronic Packaging and Production | 1975年 / 15卷 / 01期
关键词：
LASER SCRIBING;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Three techniques used for substrate separation are compared. These are: prescoring, sawing, and laser scribing. The latter has proved to be an effective tool when care is taken to minimize the degrading properties of slag by following basic guidelines enabling maximum yields and minimum cost in microcircuit manufacturing.
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页码：56 / 58
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