Step-by-step SMT: Test and inspection

被引：0

作者：

Oresjo, Stig ^{[1
]}

机构：

[1] Hewlett-Packard, Loveland, United States

来源：

Surface mount technology | 1996年 / 10卷 / 10期

关键词：

Automatic optical inspection (AOI) - Flying probe tester - In circuit testers (ICT) - Manufacturing defect analyzer (MDA) - Solder paste inspection;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The test and inspection of printed circuit boards (PCB) must be carefully optimized at various points in the assembly process to minimize the manufacturing cost. Each level of test and inspection already covers a significant portion of the assembly fault and process control. Treating each step as part of the overall process will reduce redundant coverage and result in cost savings.

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